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- HY234 Thermal Paste, Compound Silicone Grease...
HY234 Thermal Paste, Compound Silicone Grease, Low Thermal Resist High Thermal Conductivity Thermal Compound Paste for CPU Heatsink (10g)
XCD 63
Price Details
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*All items will import from US
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This thermal paste features low thermal resist and high thermal conductivity, ensuring efficient heat transfer from the CPU to the heat sink.
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What Stands Out
Product Details
| Package Dimensions | 3.15 x 2.36 x 1.18 inches (8 x 6 x 3 cm) |
| Item Weight | 0.882 ounces (25 grams) |
| Manufacturer | ANKROYU |
| Item model number | ANKROYUuos9hkmgvw-11 |
| Date First Available | November 19, 2024 |
Who Should Buy?
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PC Builders
Ideal for DIY PC builders who require efficient thermal management for CPUs and help maintain optimal performance.
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Overclocking Enthusiasts
Great for users looking to enhance cooling efficiency for overclocked CPUs to prevent overheating during intensive tasks.
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Budget Gamers
A cost-effective solution for gamers seeking reliable thermal management without breaking the bank when upgrading systems.
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Professional Modders
May not meet the high-performance needs of professional modders seeking top-tier thermal compounds for extreme builds.
Product Description
HY234 Thermal Paste, Compound Silicone Grease, Low Thermal Resist High Thermal Conductivity Thermal Compound Paste for CPU Heatsink (10g)
Customer Questions & Answers
-
Question:
What is the temperature range for this thermal paste?
Answer: The thermal paste can operate between -50 to 340℃. -
Question:
Is this thermal paste suitable for beginners?
Answer: Yes, it is designed for both amateur builders and seasoned professionals. -
Question:
How much product do I receive in the package?
Answer: The package includes 1 x Thermal Paste and 1 x Scoop.
ANKROYU Silicon Grease ANKROYUuos9hkmgvw-11 Editorial Review
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Product Price History
Important information
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XCD 63
Order now and get it around Sunday, September 27
This item is not restrict in my country.(Please click on above link if this item is not restrict in your country, So our team will review and allow.)
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Features & Benefits
- High thermal conductivity of 4.0W/m-k for efficient heat transfer.
- Excellent insulation performance to protect against electrical damage.
- Versatile application for CPUs, VGAs, and chipsets.
- Ideal for high-performance applications requiring effective heat management.
- Compact and portable design for easy storage and transport.
- Sufficient capacity for multiple applications.
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